Premium
Analysis of Concurrent Grain Growth During Creep of Polycrystalline Alumina
Author(s) -
Chokshi Atul H.,
Porter John R.
Publication year - 1986
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1986.tb04733.x
Subject(s) - creep , grain growth , materials science , crystallite , grain size , stress (linguistics) , kinetics , strain (injury) , metallurgy , composite material , medicine , linguistics , philosophy , physics , quantum mechanics
During low‐stress creep experiments in a fine‐grained alumina, the strain rates decreased continuously with time due to the occurrence of concurrent grain growth. The grain‐growth kinetics were independent of the applied stress and depended only on the time of exposure to the elevated test temperature. An analysis of the effect of concurrent grain growth was consistent with experimental observations.