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Kinetics of Liquid Spreading and Penetration with Application to RuO 2 −Glass Thick‐Film Resistors
Author(s) -
SARMA D. H. R.,
VEST R. W.
Publication year - 1985
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1985.tb15317.x
Subject(s) - contact angle , resistor , materials science , penetration (warfare) , kinetics , capillary action , microstructure , composite material , phase (matter) , analytical chemistry (journal) , thermodynamics , chemistry , chromatography , physics , organic chemistry , quantum mechanics , voltage , operations research , engineering
The rate of spreading of a spherical liquid droplet on a flat substrate is analyzed using the time‐dependent contact angle approach. The constants in the contact angle development equation are explicitly related to physical parameters. Normalized rate of spreading is shown to be independent of the volume of the liquid droplet. A general capillary flow equation incorporating the time‐dependent contact angle is used to analyze the kinetics of infiltration of the glass phase into the conductive phase in RuO 2 /lead‐horosilicate‐glass thick‐film resistors. The dependence of the kinetics on temperature, interparticle separation, and dissolved alumina content of the glass are discussed with reference to microstructure development in these resistors.