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High‐Temperature Mechanical Properties and Microstructures for Hot‐Pressed Silicon Nitrides with Amorphous and Crystalline Intergranular Phases
Author(s) -
Knickerbocker Sarah H.,
Zangvil Avigdor,
Brown Sherman D.
Publication year - 1985
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1985.tb15306.x
Subject(s) - materials science , silicon nitride , grain boundary , intergranular corrosion , composite material , amorphous solid , intergranular fracture , fracture (geology) , microstructure , flexural strength , transmission electron microscopy , hot pressing , nitride , phase (matter) , silicon , metallurgy , crystallography , nanotechnology , chemistry , organic chemistry , layer (electronics)
Four‐point flexure tests were performed at 1100° to 1350°C on two hot‐pressed silicon nitrides, one in which the grain‐boundary phase was amorphous and one in which it was largely crystalline. Fracture stress and relative K 1c were plotted vs temperature. Fracture regions were analyzed by scanning and transmission electron microscopy. Grain‐boundary phases affected high‐temperature fracture significantly.