Premium
Fracture Toughness of High‐Pressure‐Sintered Diamond/Silicon Nitride Composites
Author(s) -
Noma Tatsuo,
Sawaoka Akira
Publication year - 1985
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1985.tb11528.x
Subject(s) - materials science , fracture toughness , composite material , diamond , toughening , silicon nitride , ceramic , toughness , nitride , fracture (geology) , layer (electronics)
Diamond particles were dispersed in silicon nitride, sintered at 6 GPa and 1600°C for 30 min, and heat‐treated under vacuum at 1300°C to induce graphitization of the diamond. Improved fracture toughness values up to 7.5 MN/m 312 were achieved for these composites. Stress‐induced microcrack toughening is considered to be a plausible toughening mechanism. Comparisons with diamondlalumina ceramics were made.