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Evaluation of Reliability of Brittle Components by Thermal Stress Testing
Author(s) -
JOHNSONWALLS D.,
DRORY M. D.,
EVANS A. G.,
MARSHALL D. B.,
FABER K. T.
Publication year - 1985
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1985.tb10143.x
Subject(s) - brittleness , reliability (semiconductor) , capacitor , materials science , stress (linguistics) , composite material , population , thermal , forensic engineering , reliability engineering , structural engineering , engineering , thermodynamics , electrical engineering , physics , power (physics) , linguistics , philosophy , demography , voltage , sociology
A thermal stressing technique was applied to evaluate two distinct flaw populations (surface and corner) in BaTiO 3 multilayer capacitors. The mechanical reliability of the capacitors was deduced by relating the thermal stress response to the mechanical strength of the material. The surface flaw population alone yields relatively high survival probabilities, whereas incorporation of the corner flaw population severely reduces the probability of survival.