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Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging
Author(s) -
HSUEH C. H.,
EVANS A. G.
Publication year - 1985
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1985.tb09648.x
Subject(s) - microelectronics , materials science , residual stress , ceramic , cracking , indentation , work hardening , composite material , porosity , hardening (computing) , metallurgy , nanotechnology , microstructure , layer (electronics)
Residual stresses that develop in a metal/ceramic system due to thermal expansion mismatch were calculated for a work‐hardening metal. The calculations were conducted for a cylindrical configuration, pertinent to certain microelectronics packaging systems. Experimental measurements of the stress have also been made on a Cu/cordierite ceramic system, using an indentation technique. It is shown that porosity in the metal can plastically expand and provide a mode of dilatational relaxation. Porosity in the metal thus emerges as an important stress‐relaxing mechanism.