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New Method for solid‐state Bonding Between Ceramics and Metals
Author(s) -
Suganuma Katsuki,
Okamoto Taika,
Shimada Masahiko,
Koizumi Mitsue
Publication year - 1983
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1983.tb10605.x
Subject(s) - materials science , thermal shock , ceramic , solid state , diffusion bonding , thermal expansion , composite material , composite number , diffusion , thermal , metallurgy , engineering physics , thermodynamics , physics , engineering
A new method, for solid‐state bonding between ceramics and metals was developed. An interlayer, which is a composite of the materials to be bonded, is used. The technique can be applied to materials which cannot be bonded by conventional diffusion‐bonding methods because of thermal‐expansion mismatches. It is ex pecked that the bonded materials will have excellent thermal shock resistance .