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Effect of Hot‐Pressing Temperature on the Thermal Diffusivity/Conductivity of SiC/AlN Composites
Author(s) -
Bentsen Larry D.,
Haselman D. P. H.,
Ruh Robert
Publication year - 1983
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1983.tb10029.x
Subject(s) - thermal diffusivity , hot pressing , materials science , thermal conductivity , composite material , pressing , thermal conductivity measurement , conductivity , thermodynamics , chemistry , physics
Data are presented for the thermal diffusivity/conductivity of hot‐pressed mixtures of SiC and AlN. Results indicate that hot‐pressing at higher temperatures, which permits solid‐solution formation, results in significantly lower thermal diffusivity/conductivity than is obtained by hot‐pressing at lower temperatures, at which discrete phases exist.