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Dynamic Fracture Toughnesses of Reaction‐Bonded Silicon Nitride
Author(s) -
KOBAYASHI ALBERT S.,
EMERY ASHLEY F.,
LIAW BEEN MING
Publication year - 1983
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1983.tb09994.x
Subject(s) - fracture toughness , materials science , silicon nitride , brittleness , composite material , stress intensity factor , silicon , wedge (geometry) , fracture mechanics , cantilever , toughness , nitride , boron nitride , metallurgy , geometry , mathematics , layer (electronics)
Dynamic fracture toughness specimens consisting of 5.1‐mm thick, modified wedge‐loaded, tapered double‐cantilever‐beam (WL‐MTDCB) specimens, which are side‐grooved on one side, were used to establish the room‐temperature dynamic fracture toughness, K ID vs crack velocity, a , relations of two reaction‐bonded silicon nitrides. The measured dynamic crack extension histories were then used to drive a dynamic finite‐element code in its generation mode which computes the dynamic stress intensity factors for a given crack extension. Results indicate that the K ID vs a relations of reaction‐bonded silicon nitrides do not follow the general trend in those relations of brittle polymer and steel. The slow initial crack velocity which was reported for glass was observed again in silicon nitride and resulted in a nonunique K ID vs a relation, in contrast to the unique K ID vs a material properties reported for brittle polymers and metals.