Premium
Fracture of Directionally Solidified Multicrystalline Silicon
Author(s) -
Chen C. P.,
Leipold M. H.,
Helmreich D.
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb10413.x
Subject(s) - directional solidification , silicon , materials science , fracture toughness , fracture (geology) , metallurgy , composite material , microstructure
Fracture toughness data is given for multicrystalline silicon which has been prepared by directional solidification. Results indicated a K IC of 0.8 to 0.87 MN /m 3/2 , which is consistent with data for single‐crystal silicon.