Premium
Mechanical Properties of Liquid‐Phase‐Bonded Copper‐Ceramic Substrates
Author(s) -
WITTMER M.,
BOER C. R.,
GUDMUNDSON P.,
CARLSSON J.
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb10384.x
Subject(s) - ceramic , fabrication , materials science , copper , liquid phase , composite material , phase (matter) , metallurgy , chemistry , physics , organic chemistry , medicine , alternative medicine , pathology , thermodynamics
Liquid‐phase bonding of copper foils to ceramic substrates is a very attractive technique for the fabrication of metallized substrates for hybrid power electronics applications. The design and reliability considerations of such substrates necessitate the knowledge of their mechanical properties. Therefore, stresses and strains in the copper and in the ceramic of bonded substrates were investigated. Theoretical calculations are presented to support the experimental results and to find the influence of stresses and strains in the fabrication of copper ceramic substrates using the liquid‐phase‐bonding technique.