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Structural Reliability:A Processing‐Dependent Phenomenon
Author(s) -
EVANS A. G.
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb10380.x
Subject(s) - materials science , microstructure , reliability (semiconductor) , materials processing , structural reliability , ceramic , fracture (geology) , principal stress , composite material , computer science , process engineering , engineering , shear stress , artificial intelligence , physics , power (physics) , probabilistic logic , quantum mechanics
The principal sources of fracture in ceramic polycrystals have been identified; they include surface cracks produced during surface finishing and voids, inclusions, or large grains generated during processing. The dominance of a specific fracture source depends on the microstructure, test temperature, and stress distribution. The origins of processing‐induced defects have been examined and certain dominant processing variables identified. Connections between processing and structural reliability have thereby been established.