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Stress Analysis on the Wall‐to‐Base Joint in a Flat Package
Author(s) -
LOH EUGENE
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb09943.x
Subject(s) - residual stress , materials science , joint (building) , brazing , ceramic , tension (geology) , composite material , microstructure , stress (linguistics) , base (topology) , structural engineering , engineering , compression (physics) , alloy , mathematical analysis , linguistics , philosophy , mathematics
Cracks developed in the ceramic base adjacent the wall‐to‐base joint in a flat package are attributed to internal and external factors. Residual stress due to thermal mismatch between joining parts during cooling after the brazing operation, change of microstructure introduced by the high‐temperature sealing operation in the ceramic base, and the effect of external stress, induced by membrane tension in the stretched thin lid of the flat package under bomb pressure, are discussed.