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Residual Stresses in Hot‐Pressed Si 3 N 4 Grooved by Single‐Point Grinding
Author(s) -
KIRCHNER H. P.,
ISAACSON E. D.
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb09923.x
Subject(s) - materials science , residual stress , grinding , flatness (cosmology) , composite material , silicon nitride , diamond , residual , wedge (geometry) , silicon , metallurgy , optics , physics , cosmology , algorithm , quantum mechanics , computer science
Hot‐pressed silicon nitride plates were grooved by single diamond points with varying degrees of flatness mounted on a wheel rotating at varying speeds. The plates were divided into bars and the remaining strengths were measured. The depths of damage were measured and used to calculate the theoretical strengths. For sharp diamonds and in some cases for diamonds with flat tips, the measured strengths were less than the theoretical strengths. The differences between the measured strengths and the theoretical strengths are attributed to the presence of residual loads acting to wedge open the cracks.