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Analysis and Measurement of Glue‐Spall Stresses in Glass‐Epoxy Bonds
Author(s) -
GULATI SURESH T.,
HAGY HENRY E.
Publication year - 1982
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1982.tb09911.x
Subject(s) - spall , glue , epoxy , sealant , materials science , composite material , creep , stress (linguistics) , finite element method , adhesive , forensic engineering , structural engineering , engineering , philosophy , linguistics , layer (electronics)
An approximate analysis is presented of the glue‐spall stresses introduced by an organic sealant in the glass substrate to which it adheres. The results given by this analysis are compared with those obtained by the finite element method, as well as with the photoelastic measurements in glass at T=25 to −78°C during cooling. Good agreement is found between theory and experiment, if proper account is taken of the stress release due to creep of the organic sealant. Methods for minimizing glue‐spall stresses are outlined.