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Orientation Effects on the Thermal Diffusivity of Hot‐Pressed Silicon Nitride
Author(s) -
Zlegler G.,
Bentsen L. D.,
Hasselman D. P. H.
Publication year - 1981
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1981.tb09572.x
Subject(s) - thermal diffusivity , materials science , perpendicular , hot pressing , silicon nitride , pressing , composite material , silicon , elongation , nitride , thermal , orientation (vector space) , metallurgy , geometry , ultimate tensile strength , thermodynamics , physics , mathematics , layer (electronics)
The thermal diffusivity perpendicular to the hot‐pressing direction for a variety of silicon nitrides was found to be higher than parallel to the hot‐pressing direction. This effect was attributed to the preferred elongation of the β‐grains perpendicular to the hot‐pressing direction.