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Fracture and Crack Healing in (U,Pu)C
Author(s) -
SINGH R. N.,
ROUTBORT J. L.
Publication year - 1979
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1979.tb19036.x
Subject(s) - materials science , fracture (geology) , intergranular fracture , transgranular fracture , stress (linguistics) , flow stress , composite material , intergranular corrosion , strain rate , strain (injury) , microstructure , medicine , linguistics , philosophy
The fracture stress of several types of (U,Pu)C 1+x pellets was measured from 25° to 1200°C at a fixed strain rate. The fracture stress increases with temperature and the fracture is predominantly transgranular up to ≊500°C. At >500°C, the fracture stress decreases as the temperature increases and the fracture becomes increasingly intergranular. The flow stress, σ 0.002 , decreased rapidly between 1000° and 1600°C. An investigation of the stress dependence and kinetics of crack healing at 1300° to 1600°C indicates that strength may recover by a volume‐diffusion‐controlled mechanism.