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Enhanced Thermal Stress Resistance of Structural Ceramics with Thermal Conductivity Gradient
Author(s) -
HASSELMAN D. P. H.,
YOUNGBLOOD G. E.
Publication year - 1978
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1978.tb09228.x
Subject(s) - thermal conductivity , materials science , ceramic , composite material , thermal contact conductance , temperature gradient , thermal conduction , thermal resistance , thermal , thermal transmittance , thermal effusivity , brittleness , ultimate tensile strength , stress (linguistics) , thermodynamics , linguistics , philosophy , physics , quantum mechanics
The hypothesis is presented that the maximum tensile thermal stresses in brittle ceramics can be reduced significantly by a redistribution of the temperature profile using a spatially varying thermal conductivity. On the basis of a hollow circular cylinder subjected to radially inward or outward steady‐state heat flow, it is shown that such a spatially varying thermal conductivity can lead to significant decreases in magnitude of the maximum tensile thermal stress. Possible techniques of creating such thermal conductivity variations are discussed briefly.

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