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Role of Activation Energy of Slow Crack Growth in the High‐Temperature Thermal Fatigue of Silicon Nitride
Author(s) -
HASSELMAN D. P. H.,
CHEN E. P.
Publication year - 1977
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1977.tb16099.x
Subject(s) - silicon nitride , citation , library science , ceramic , engineering physics , history , materials science , physics , computer science , silicon , metallurgy