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Role of Copper Ions in Low‐Melting Solder Glasses
Author(s) -
TAKAMORI TAKESHI,
REISMAN ARNOLD,
BERKENBLIT MELVIN
Publication year - 1976
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1976.tb10972.x
Subject(s) - copper , soldering , softening point , materials science , melting point , oxide , metallurgy , thermal expansion , durability , ion , chemical composition , viscosity , softening , composite material , chemistry , organic chemistry
Controlled melting conditions for Cu‐containing solder glasses yielded a variety of Cu + /Cu 2+ ratios from a single glass starting composition. Measurements of softening point, thermal expansion, chemical durability, plus chemical analysis revealed that the well‐known viscosity effect of adding copper oxide to solder glasses is caused primarily by the Cu + ion; Cu 2+ plays a minor role, if any.