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Effect of Microcracking on the Thermal Diffusivity of Fe 2 TiO 5
Author(s) -
SIEBENECK H. J.,
HASSELMAN D. P. H.,
CLEVELAND J. J.,
BRADT R. C.
Publication year - 1976
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1976.tb10944.x
Subject(s) - thermal diffusivity , materials science , thermal shock , composite material , crystallite , ceramic , grain size , annealing (glass) , temperature cycling , hysteresis , mineralogy , thermal , metallurgy , thermodynamics , chemistry , condensed matter physics , physics
The effect of microcracking on the thermal diffusivity of polycrystalline Fe 2 TiO 5 subjected to a range of annealing treatments was investigated. At fine grain size (∼1 μm), the thermal diffusivity exhibited the decrease with increasing temperature common for dielectrics. Extensive microcracking in the larger‐grain‐sized materials significantly decreased their thermal diffusivity. On heating, the microcracked materials exhibited increased thermal diffusivity at elevated temperatures which can be attributed primarily to microcrack closure and healing; on cooling, they exhibited a pronounced hysteresis, attributable to irreversible crack opening and closing. Thermal cycling closed the hysteresis curves, which suggests permanent changes in microcrack morphology. It appears that microcracking is a promising technique for tailoring ceramic materials to a combination of high thermal shock resistance and good insulating capability.