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Crack Healing in UO 2
Author(s) -
ROBERTS J. T. A.,
WRONA B. J.
Publication year - 1973
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1973.tb12499.x
Subject(s) - materials science , annealing (glass) , composite material , isothermal process , grain growth , metallurgy , grain size , thermodynamics , physics
Isothermal annealing of thermally shocked UO 2 bars (O/M= 2.00 ±0.01) at 1600°, 1800°, and 2000°C caused crack healing, which was determined from recovery of room‐temperature fracture strength. The activation energy for crack healing was ∼0.5 of that for volume diffusion, and healing occurred at the same rate as grain growth. This result has important implications with respect to crack healing in oxide fuels during in‐reactor restructuring.