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Electron‐Microprobe Study of Field‐Assisted Bonding of Glasses to Metals
Author(s) -
BOROM MARCUS P.
Publication year - 1973
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1973.tb12482.x
Subject(s) - electron microprobe , dissolution , microprobe , materials science , electrochemistry , oxide , metallic bonding , metal , electric field , substrate (aquarium) , dielectric , chemical bond , electron , electrode , metallurgy , composite material , chemical engineering , mineralogy , chemistry , optoelectronics , quantum mechanics , organic chemistry , geology , engineering , physics , oceanography
Quantitative electron‐microprobe evidence is presented for the specific reactions which occur at electrodes during field‐assisted bonding of glasses to metals. Adherence mechanisms are discussed in relation to conventional glass‐metal sealing techniques. It is concluded that the electric field drives electrochemical reactions which contribute to bond formation by first bringing the surfaces into large‐area contact, as a result of both dielectric forces and electrochemical removal of the high points on the metal, and then maintaining the interfacial bonding structure, established by dissolution of the substrate oxide.