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Wetting of TaC by Liquid Cu and Liquid Ag
Author(s) -
RHEE S. K.
Publication year - 1972
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1972.tb11242.x
Subject(s) - wetting , contact angle , sessile drop technique , melting point , surface energy , adhesion , materials science , drop (telecommunication) , melting temperature , wetting transition , composite material , telecommunications , computer science
Wetting of TaC 0.97±0.01 by liquid Cu and liquid Ag was studied by the sessile drop method. The cosine of the contact angle increased linearly with increasing temperature in both systems. The critical surface energy for spreading was 1098 ergs/cm 2 at 1605°C for Cu and 688 ergs/cm 2 at 2160°C for Ag. The work of adhesion, which was 1759 ergs/cm 2 at the melting point for Cu and 321 ergs/cm 2 at the melting point for Ag, increased parabolically with increasing temperature in both systems. The surface energy of TaC 0.97±0.01 was estimated to be 1804±706 ergs/cm 2 .