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Formation of NiAl 2 O 4 by Solid State Reaction
Author(s) -
PETTIT F. S.,
RANDKLEV E. H.,
FELTEN E. J.
Publication year - 1966
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1966.tb13233.x
Subject(s) - spinel , nial , diffusion , nickel , crystallite , materials science , aluminium , ion , atmospheric temperature range , layer (electronics) , analytical chemistry (journal) , inorganic chemistry , thermodynamics , metallurgy , chemistry , intermetallic , composite material , alloy , chromatography , physics , organic chemistry
The growth of nickel‐aluminum spinel, NiAl 2 O 4 , in diffusion couples of polycrystalline Al 2 O 3 and NiO was investigated between 1200° and 1500°C. The growth kinetics for the spinel layer obeyed a parabolic rate law in this temperature range. Marker experiments showed that the spinel layer formed by counterdiffusion of nickel and aluminum ions. Comparison of experimental and theoretical values of the parabolic rate constants suggests that the diffusion of aluminum ions through the spinel layer is rate controlling.