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Formation and Properties of Low‐Melting Glasses in the Ternary Systems As—TI—S, As‐TI‐Se, and As—Se—S
Author(s) -
FLASCHEN STEWARD S.,
PEARSON A. DAVID,
NORTHOVER WILLIAM R.
Publication year - 1960
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1960.tb14596.x
Subject(s) - materials science , wetting , thermal expansion , softening point , ternary operation , dielectric , softening , glass transition , mineralogy , thermodynamics , composite material , chemical engineering , polymer , chemistry , optoelectronics , computer science , programming language , physics , engineering
Glass formation has been found to be extensive in the systems As‐TI‐S, As‐Tl‐Se, and As‐Se‐S. Glasses in these systems exhibit unique low‐melting properties; some are highly fluid as low as 185OC. The marked effect of thallium in lowering the viscosity of binary As‐S melts was found to be unique among all the metallic additives studied. The glasses are stable, covalent, chemically durable, and dielectric. They exhibit good wetting properties with respect to most metals, and the permeability of the seals formed as well as the volume permeability of the glasses themselves appears to be extremely low. Linear thermal expansion coefficients of some compositions are high, but associated thermal cracking problems are minimized to some extent by the low softening temperatures. The glasses can be evaporated and directly condensed (in uacuo) to form continuous, grain‐free glassy films. The glasses are of considerable interest in the study of the nature of the vitreous state. In addition, their over‐all properties make them potentially useful for hermetic sealing of semiconductor and other moisture‐sensitive electronic components which might be damaged by high‐temperature sealing processes.