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MECHANISM OF THERMAL‐SHOCK FAILURE IN ENAMELWARE, AN OVEN‐TEST METHOD *
Author(s) -
Richmond J. C.,
Harrison W. N.
Publication year - 1947
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1947.tb18888.x
Subject(s) - thermal shock , quenching (fluorescence) , materials science , composite material , shock (circulatory) , thermal , deformation (meteorology) , enamel paint , failure mechanism , metallurgy , thermodynamics , medicine , physics , quantum mechanics , fluorescence
A bstract Enameled utensils were tested for thermal‐shock resistance by heating in an oven to a predetermined temperature, then quenching with iced water. This process was repeated, following a schedule of successively higher temperatures from 375° to 600°F. until the specimens chipped or withstood heating after the tenth quench. The method is suitable for testing most sizes and shapes of utensils. Data on a wide variety of commercial utensils are included. Photographs show that failures originate in cracks formed during quenching from stresses produced by rapid cooling and shrinking of the surface of the enamel. The chips are usually blown off with considerable force during heating following the quench by steam produced from water which penetrated the cracks during the quench. Evidence is presented that deformation of the pan bottom during heating does not produce thermal shock failures.