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Effects of CuO content in the glass on the interfacial reaction for the NiCuZn ferrites‐FeSiCr alloy composites
Author(s) -
Hsiang HsingI,
Yang ShengMao,
Chen ChihCheng
Publication year - 2020
Publication title -
international journal of applied glass science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 34
eISSN - 2041-1294
pISSN - 2041-1286
DOI - 10.1111/ijag.15512
Subject(s) - materials science , alloy , copper , microstructure , composite material , adhesion , metallurgy
The effects of CuO content in Bi‐B‐Si‐Zn glass on the interfacial reaction between the glasses and FeSiCr alloy powder and NiCuZn ferrites, microstructure, and adhesion strength were investigated. For the FeSiCr alloy and glass interface, the iron in FeSiCr alloy dissolves into the glass and is oxidized into Fe 3+ during heating. The copper ions in the glass are reduced to elemental copper near the interface to maintain charge neutrality. This leads to chemical bonding between the FeSiCr alloy and glass at 750°C under air atmosphere. The CuO in the glass increases the wettability and adhesion between the FeSiCr alloy and glass. The redox reaction inhibits crack propagation from Vickers indentations in the spherical copper‐rich precipitates near the interface, but the presence of pores in the glass layer would decrease the adhesion strength. In the FeSiCr alloy/glass/NiCuZn ferrites/glass/FeSiCr alloy structure, glass with 5 wt% CuO exhibited higher pulling strength. Moreover, the amount of elemental copper precipitates increased as the heat‐treatment temperature was increased to 800 and 850°C, leading to an increase in the glass and FeSiCr alloy adhesion strength.