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Measuring the coefficient of thermal expansion of free‐standing enamel films
Author(s) -
Velez Mariano,
Gong Yuxuan
Publication year - 2019
Publication title -
international journal of applied glass science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 34
eISSN - 2041-1294
pISSN - 2041-1286
DOI - 10.1111/ijag.12437
Subject(s) - thermal expansion , materials science , borosilicate glass , enamel paint , composite material , ceramic , digital image correlation , residual stress , soda lime glass
Digital image correlation ( DIC ) was applied to the measurement of the coefficient of thermal expansion ( CTE ) of ceramic enamel films between 100 and 300°C. The CTE of four different enamels were measured by DIC , and the data were correlated with the residual stresses on fired enameled soda‐lime glass substrates. For validation, the CTE of a zinc‐containing alkali borosilicate glass was measured by DIC and push‐rod dilatometry. The results suggested that DIC is an effective technique for measuring the CTE of ceramic enamel films.