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Modeling the Embossing Stage of the Ultrasonic‐Vibration‐Assisted Hot Glass Embossing Process
Author(s) -
Nguyen Lan Phuong,
Hao KeiChon,
Su YiHsiang,
Hung Chinghua
Publication year - 2015
Publication title -
international journal of applied glass science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 34
eISSN - 2041-1294
pISSN - 2041-1286
DOI - 10.1111/ijag.12090
Subject(s) - embossing , materials science , vibration , formability , ultrasonic sensor , viscoelasticity , composite material , finite element method , dissipation , process (computing) , mechanical engineering , acoustics , structural engineering , computer science , engineering , physics , thermodynamics , operating system
Ultrasonic vibration technology has recently been applied in high‐temperature forming processes, such as hot upsetting and hot glass embossing. Experimental research has delineated the effects of ultrasonic vibration on reducing required forces and improving the formability of materials. The purpose of this study was to construct a finite element model of the embossing stage of the ultrasonic vibration‐assisted hot glass embossing process. Traditional hot embossing experiments in which the embossing speed and temperature were varied were performed to calculate the viscoelastic dissipation caused by ultrasonic vibration, and this value was then inputted into the simulation. The consistency of the force responses in the experiments and simulation indicated that the proposed model is valid. The findings indicate that the influences of parameters such as the vibration frequency, vibration amplitude, and embossing speed on the ultrasonic vibration‐assisted hot glass embossing process must be investigated further.