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Fast seamless joining of SiC w /Ti 3 SiC 2 composite using electric field‐assisted sintering technique
Author(s) -
Zhou Xiaobing,
Shi LinKun,
Zou Shunrui,
Xu Jie,
Liu Yihe,
Tatarko Peter
Publication year - 2021
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.13799
Subject(s) - materials science , sintering , microstructure , composite material , whiskers , diffusion bonding , cladding (metalworking) , composite number , electric field , silicon carbide , physics , quantum mechanics
A pair of Ti 3 SiC 2 reinforced with SiC whiskers (SiC w /Ti 3 SiC 2 ) composites was successfully joined without any joining materials using electric field‐assisted sintering technology at a temperature as low as 1090°C ( T i ) and a short time of 30 s. The microstructure and mechanical properties of the obtained SiC w /Ti 3 SiC 2 joints were investigated. The solid‐state diffusion was the main joining mechanism, which was facilitated by a relatively high current density (~586 A/cm 2 ) at the joining interface. The shear strength of the sample joined at 1090°C was 51.8 ± 2.9 MPa. The sample joined at 1090°C failed in the matrix rather than at the interface, which confirmed that a sound inter‐diffusion bonding was obtained. A rapid and high efficient self‐joining process may find application in the case of SiC w /Ti 3 SiC 2 sealing cladding tube and end cap.