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Study on the effect of Ti, Al, Cu, and Ag doping on the bonding properties of soldered β ‐Sn(100)/ZrO 2 (111) interface
Author(s) -
Guo Weibing,
She Zongyu,
Xue Haitao,
Zhang Xiaoming
Publication year - 2020
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.13624
Subject(s) - materials science , soldering , doping , covalent bond , ionic bonding , ceramic , wetting , adhesion , atom (system on chip) , brazing , metal , chemical bond , composite material , crystallography , metallurgy , ion , alloy , optoelectronics , chemistry , physics , quantum mechanics , computer science , embedded system , organic chemistry
Selecting active elements for filler metal is very important in soldering of ZrO 2 ceramics. In this paper, the effects of Ti, Al, Cu, and Ag active elements on the bonding strength and electronic structures of soldered β ‐Sn(100)/ZrO 2 (111) interface were studied via the method of first principle calculation. The work of adhesion ( W ad ) results show that the O 2 ‐terminated interface is more stable than other kinds of interfaces. Then, the atoms of Ti, Al, Cu, and Ag were doped into the interface by replacing the Sn atom in situ. It is found that additions of Ti, Al, and Cu atoms can increase the W ad , and Ag atom has the opposite effect. From the results of heat of segregation, doping Ti and Al into the interface is stable in thermodynamics and doping Cu and Ag is not stable. The forming of strong ionic‐covalent Ti‐O and Al‐O bonding contributes to the increase of the interfacial adhesion strength. The calculation results indicate that Ti and Al can act as active elements in Sn to solder ZrO 2 . The Ti‐O and Al‐O compounds formed at interface can improve the wetting and bonding between Sn‐based solder and ZrO 2 ceramics.