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Enhancement of bonding strength between lead wires and ceramic matrix of metal ceramic heater
Author(s) -
Zhu Feng,
Liu Huachen,
Yan Baijun,
Deng Tengfei
Publication year - 2019
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.13319
Subject(s) - materials science , ceramic , composite material , spinel , microstructure , metallic bonding , metal , oxide , scanning electron microscope , bonding strength , metallurgy
In recent years, metal ceramic heaters (MCHs) have become widely used in daily life and industrial applications. This paper introduces a method for producing an MCH with high bonding strength of the bonding wires by adding oxide additives (Al 2 O 3 , SiO 2 , and MgO) to a metal slurry. Pilot experiments were carried out at 1600°C under a protective atmosphere. The results indicate that the temperature coefficient of resistance of the samples decreases whereas the bonding strength vastly increases, and the pulling forces of the bonding wires in the samples extends from 2 to 32 N. The pulling forces are progressively increased as the content of the spinel phase in the oxide additives increases. The mechanism of enhancement of the bonding strength is discussed herein. The microstructure characterization, element mapping, and element analysis of different samples were performed using a scanning electron microscope (SEM). The results indicate that the formation of a W‐Si solid solution in the sample is the main reason for the decrease in temperature coefficient of resistance. The interface between the metal and spinel layers forms a zigzag and interlocked shape, which significantly improves the bonding strength between the lead wires and the ceramic matrix of the MCH.