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Enhancement of photocatalytic performance of P25‐TiO 2 nanoparticles by 3D nanoporous anodic alumina at room temperature
Author(s) -
Chung ChenKuei,
Liao MingWei,
Kuo EnHao,
Wang ZhouWei
Publication year - 2017
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12799
Subject(s) - materials science , photocatalysis , nanoporous , calcination , chemical engineering , nanoparticle , coating , ceramic , porosity , sintering , anode , nanotechnology , composite material , catalysis , electrode , biochemistry , chemistry , engineering
The commercial Degussa P25‐TiO 2 nanoparticles consisting of a mixed phase are a crucial environmental catalyst but encounter the robust coating problem onto the solid support for poor photocatalysis. Here, we have demonstrated a useful green method for greatly improving water‐flushing robust coating as well as photocatalysis by over‐etched three‐dimensional (3D) nanoporous anodic aluminum oxide ( AAO ) that can be fabricated by large‐scale electrochemical‐anodic‐oxidation processing at room temperature instead of high‐temperature sintering for traditional ceramic foams up to 1200°C. Also, no additional high‐temperature calcination of 400~900°C was needed. The 3D porous morphology exhibited more TiO 2 particles attachment on the rough surface and enlarged pore channels than the 2D. Moreover, the over‐etched 3D AAO exhibited the most attachment of TiO 2 nanoparticles after water flushing due to high‐porosity‐and‐contact‐area 3D morphology which enhances the bonding between the substrate and nanoparticles for robust coating. XRD and SEM were used for analyzing the mixed phase and 2D‐3D morphology of the P25‐TiO 2 nanoparticles on AAO . After immersion in Methylene blue solution and 20 hour of UV illumination, TiO 2 nanoparticles on the over‐etched 3D AAO with robust coating showed the best decomposition rate compared to other supports including Si wafer, typical 2D and 3D AAO .