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In Situ ‐Strengthened C/SiC Joint Brazed with Cu‐Based Active Filler and Its Performance
Author(s) -
Chen Jie,
Dong Shaoming,
Zhang Xiangyu,
Kan Yanmei,
Feng Qian
Publication year - 2015
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12391
Subject(s) - materials science , brazing , microstructure , scanning electron microscope , titanium , whiskers , transmission electron microscopy , composite material , shear strength (soil) , metallurgy , carbide , alloy , nanotechnology , environmental science , soil science , soil water
Three‐dimensional needled C/SiC composites were brazed in vacuum with Cu–Ti–Al active filler at 950–1040°C for 10–30 min. The joint microstructure and fracture surface were characterized by optical microscopy ( OM ), scanning electron microscopy ( SEM ), energy‐dispersive spectroscopy ( EDS ), X‐ray diffraction ( XRD ), and transmission electron microscopy ( TEM ). A reaction layer filled with fine titanium carbide and titanium silicide grains was formed at the interface. Titanium carbide and titanium silicide particles and whiskers were also in situ formed in the brazing seam. Shear strength of the joint brazed at 970°C for 15 min was 85 MP a, 33 MP a, and 18 MP a at room temperatures 600 and 800°C, respectively.