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Thermal Expansion Mismatch Analysis of Nano‐bonded Refractory Castables
Author(s) -
Prestes Eduardo,
Souza Tiago,
Pandolfelli Victor,
Gomes Daniel
Publication year - 2014
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12287
Subject(s) - materials science , thermal expansion , composite material , elastic modulus , ultimate tensile strength , thermomechanical analysis , thermal , modulus , stress (linguistics) , young's modulus , raw material , thermodynamics , linguistics , philosophy , physics , chemistry , organic chemistry
A mathematical model to predict the thermomechanical stresses was used to understand the expansion mismatch damage in castables, evaluated by hot elastic modulus measurements. The results indicated that via elastic modulus evaluation and the tensile stress calculation, the critical interactions among the particles leading to the formation of flaws were identified. To assure the materials' integrity, it is fundamental to keep a low Δα between the components and not only a low overall linear thermal expansion coefficient. For multicomponent compositions, a second‐phase raw material with different properties should be added as finer particles to minimize the thermomechanical stresses generated.