Premium
The Comparison of Sheet Resistances of Screen‐ and Stencil‐Printed Resistors
Author(s) -
Jurków Dominik,
Dorczyński Mateusz
Publication year - 2014
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12286
Subject(s) - resistor , stencil , materials science , fabrication , sheet resistance , ceramic , sintering , chalcogenide , optoelectronics , trimming , screen printing , composite material , electrical engineering , mechanical engineering , computer science , layer (electronics) , engineering , voltage , medicine , alternative medicine , computational science , pathology
The deposition of the precise thick‐film buried resistors (with better tolerance) is one of the factors that can increase the integration of the low‐temperature co‐fired ceramic devices further. The thick‐film buried resistors cannot be trimmed after sintering or the trimming is very difficult in the contradiction to the surface resistors. The possibility of utilizing simple stencil printing in the fabrication of thick‐film resistors is presented in this paper. Moreover, the comparison of the variability of the sheet resistances of the screen‐ and stencil‐printed buried resistors was performed using Taguchi Design of the Experiment methodology.