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Joining of SiC Fiber‐Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon‐Based Alloy Interlayers
Author(s) -
Asthana Rajiv,
Singh Mrityunjay,
Lin HuaTay,
Matsunaga Tadashi,
Ishikawa Toshihiro
Publication year - 2013
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12161
Subject(s) - materials science , brazing , eutectic system , alloy , copper , ceramic , perpendicular , composite material , fiber , metallurgy , silicon , palladium , nickel , biochemistry , chemistry , geometry , mathematics , catalysis
SiC fiber‐bonded ceramics, SA ‐Tyrannohex ® , ( SA ‐ THX ) with perpendicular and parallel fiber orientations were brazed using Ag‐, Ni‐ and Pd‐base brazes, and four Si–X (X: Ti, Cr, Y, Ta) eutectics. Outcomes were variable, ranging from bonded joints through partially bonded to un‐bonded joints. Prominent Ti‐ and Si‐rich interfaces developed with Cusil‐ ABA , Ticusil, and Copper‐ ABA and Ni‐ and Si‐rich layers with MBF ‐20. Stress rupture tests at 650 and 750°C on Cusil‐ ABA ‐bonded joints revealed a temperature‐dependent behavior for the perpendicular joints but not for the parallel joints with failure occurring at brazed interface. Higher‐use temperatures can be targeted with eutectic Si–Ti and Si–Cr alloys.