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Silicon Nitride—Grain Boundary Oxynitride Glass Interfaces: Deductions From Glass Bulk Properties
Author(s) -
Hampshire Stuart,
Pomeroy Michael J.
Publication year - 2013
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12136
Subject(s) - materials science , silicon nitride , silicon oxynitride , grain boundary , residual stress , intergranular corrosion , ceramic , thermal expansion , nitride , composite material , silicon , mineralogy , metallurgy , microstructure , layer (electronics) , chemistry
Oxynitride glasses exist as grain boundary phases in Si 3 N 4 ceramics. This paper provides an overview of oxynitride glasses outlining effects of composition on properties. A review of the effects of grain boundary glass chemistry on fracture resistance of silicon nitride is given. A knowledge of overall additive compositions and their quantities in Si 3 N 4 combined with measured properties of bulk glasses allows residual stresses in the interfacial glasses to be calculated. Increase in Y:Al ratio leads to higher thermal expansion mismatch and higher residual stresses in intergranular glasses. Values are in good agreement with those obtained using micromechanical finite element analysis.