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Silicon Carbide Whisker‐Reinforced Ceramic Tape for High‐Power Components
Author(s) -
Doo Sae Han Na,
Lim Won Bae,
Lee Jun Seok,
Han Chan Su,
Cho Yong Soo,
Yoo Chang Geun
Publication year - 2013
Publication title -
international journal of applied ceramic technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.4
H-Index - 57
eISSN - 1744-7402
pISSN - 1546-542X
DOI - 10.1111/ijac.12127
Subject(s) - materials science , whisker , whiskers , silicon carbide , monocrystalline whisker , flexural strength , ceramic , composite material , microstructure , silicon nitride , thermal conductivity , tape casting , nitride , carbide , aluminium , filler (materials) , layer (electronics)
An attempt to enhance both mechanical strength and thermal conductivity of glass‐based tapes is described. Flexural strength of ~420 MPa and thermal conductivity of ~10.3 W/m/K have been achieved in fully densified tape comprising calcium aluminoborosilicate glass, aluminum nitride, and silicon carbide whiskers. Silicon carbide whiskers aligned parallel to the casting direction contributed significantly to the reinforcement of the microstructure with accompanying extensive densification over a broad temperature range. These results are compared with the more typical alumina filler substituted for the aluminum nitride.