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DIC‐based J ‐integral evaluation of laser repaired cracks with micro/nanomaterial addition
Author(s) -
Li Yinyin,
Jiang Wei
Publication year - 2019
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/ffe.13040
Subject(s) - residual stress , materials science , digital image correlation , fracture (geology) , tension (geology) , laser , composite material , residual , machining , measure (data warehouse) , beam (structure) , structural engineering , j integral , stress intensity factor , fracture mechanics , optics , mathematics , computer science , compression (physics) , algorithm , engineering , physics , metallurgy , database
Cracks generated by a wire electric discharge machining on compact tension specimens are first repaired by high powered laser beam with different weight fractions of nano‐WC added at the crack tip. Digital image correlation method combined with J ‐integral theory is used to measure and calculate J ‐integrals of the repaired specimens. Fracture properties of the repaired specimens are compared and studied. The residual stress of specimens after being repaired by laser was also studied to analyze the feasibility of J ‐integral to evaluate the fracture properties of the repaired parts. It is found that the influence of residual stress can be neglected when calculating J ‐integral in a certain region in case of when the residual stress is small. The J ‐integral obtained by the digital image correlation measurement is accurate and can effectively evaluate repairing effects. The paper provides guidance for laser repaired cracks with nanomaterial addition and an effective method for the evaluation of repairing effect.