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Transient elastic‐plastic‐creep crack‐tip stress fields under load‐controlled loading
Author(s) -
Lee H.S.,
Kim D.J.,
Kim Y.J.,
Ainsworth R.A.,
Budden P.J.
Publication year - 2018
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/ffe.12740
Subject(s) - creep , materials science , plane stress , crack closure , structural engineering , stress (linguistics) , crack tip opening displacement , stress intensity factor , transient (computer programming) , crack growth resistance curve , stress field , mechanics , tension (geology) , finite element method , fracture mechanics , power law , stress relaxation , composite material , ultimate tensile strength , engineering , physics , mathematics , computer science , linguistics , philosophy , statistics , operating system
This paper presents transient and steady‐state elastic‐plastic‐creep crack‐tip stress fields under load‐controlled loading conditions for a wide range of combinations of power‐law plastic and creep materials. The crack‐tip stress fields are characterized in terms of 2 parameters to accommodate the crack‐tip constraint effect; the C ( t ) ‐ (or C*‐ ) integral and the β Q parameter (the Q ‐parameter normalized with respect to the proximity parameter to plastic collapse). For practical application, the crack‐tip stress fields are re‐formulated explicitly in terms of time and crack‐tip stress fields for elastic‐plastic and steady‐state creep conditions. Comparison with detailed FE results for plane strain tension and bend specimens shows that this formulation of the crack‐tip stress fields agrees well with finite element results.