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A nonlinear fatigue damage‐healing model for copper film by LSP
Author(s) -
Zhang LH.,
Shang DG.,
Liu XD.,
Sun YJ.,
Guo YB.,
Liu FZ.,
Chen T.
Publication year - 2014
Publication title -
fatigue and fracture of engineering materials and structures
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.887
H-Index - 84
eISSN - 1460-2695
pISSN - 8756-758X
DOI - 10.1111/ffe.12203
Subject(s) - peening , materials science , nonlinear system , ductility (earth science) , shock (circulatory) , structural engineering , amplitude , variable (mathematics) , fatigue testing , composite material , residual stress , optics , engineering , mathematics , physics , medicine , mathematical analysis , creep , quantum mechanics
The healing variable and enhancement variable were first defined by the fatigue ductility, and then based on the relationship of the damage variable, the healing variable and the enhancement variable, a nonlinear fatigue damage‐healing model was proposed for predicting the fatigue life of the healed copper film by laser shock peening (LSP). The nonlinear fatigue damage cumulative process was considered in the model for the original specimen without LSP under constant and variable amplitude loadings. The results showed that the proposed nonlinear fatigue damage‐healing model can predict the residual fatigue life for the damaged copper film specimen well.