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Influence of 38% silver diamine fluoride application on bond stability to enamel and dentin using universal adhesives in self‐etch mode
Author(s) -
Markham Mark D.,
Tsujimoto Akimasa,
Barkmeier Wayne W.,
Jurado Carlos A.,
Fischer Nicholas G.,
Watanabe Hidehiko,
Baruth Andrew G.,
Latta Mark A.,
GarciaGodoy Franklin
Publication year - 2020
Publication title -
european journal of oral sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.802
H-Index - 93
eISSN - 1600-0722
pISSN - 0909-8836
DOI - 10.1111/eos.12701
Subject(s) - enamel paint , dentin , adhesive , bond strength , composite material , materials science , shear strength (soil) , universal testing machine , dentistry , ultimate tensile strength , layer (electronics) , medicine , environmental science , soil science , soil water
In order to evaluate the influence of 38% silver diamine fluoride (SDF) application on enamel and dentin bond stability of universal adhesives in self‐etch mode, a 38% SDF and three universal adhesives were used in this study. Initial shear bond strength (ISBS), fatigue bond strength (FBS), and shear bond strength of survivors (SBSS) to enamel and dentin of universal adhesives in self‐etch mode, with and without SDF application, were determined. SDF was applied to the polished enamel or dentin surface for 1 min, water‐rinsed and air‐dried for comparison with controls. The universal adhesives were applied to the prepared samples and composite resin was bonded using a mold‐enclosed method. Enamel bond stability of universal adhesives with SDF (ISBS: 14.7–20.4 MPa; FBS: 5.5–7.4 MPa and SBSS: 14.4–21.5 MPa) was significantly weaker than those without SDF (ISBS: 28.0–29.2 MPa; FBS: 12.1–15.6 MPa and SBSS: 28.4–34.4 MPa). Dentin bond stability with SDF (ISBS: 14.8–20.9 MPa; FBS: 7.1–8.2 MPa and SBSS: 17.3–21.8 MPa) was also significantly weaker than without SDF (ISBS: 19.3–36.1 MPa; FBS: 11.0–13.7 MPa and SBSS: 22.2–34.6 MPa). The results suggest that SDF application on enamel and dentin reduces the bond stability of universal adhesives in self‐etch mode.