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Optimization of direct currents to enhance dentine bonding of simplified one‐step adhesive
Author(s) -
Chen Hongfei,
Fu Dongjie,
Yang Hongye,
Liu Yinchen,
Huang Yanyu,
Huang Cui
Publication year - 2014
Publication title -
european journal of oral sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.802
H-Index - 93
eISSN - 1600-0722
pISSN - 0909-8836
DOI - 10.1111/eos.12140
Subject(s) - scanning electron microscope , molar , materials science , bond strength , adhesive , viability assay , composite material , pulp (tooth) , atomic force microscopy , dentistry , chemistry , nanotechnology , cell , medicine , biochemistry , layer (electronics)
The aim of this study was to investigate the effects of different direct current intensities on dentine bonding effectiveness of Clearfil S 3 Bond and on cell viability of human dental pulp cells ( HDPC s). Thirty‐five‐third molars were sectioned and ground to provide flat surfaces. Clearfil S 3 Bond was applied under different current conditions for 30 s and then resin composite was built up. Specimens were processed for microtensile bond strength ( µ TBS ) testing and for nanoleakage investigation using scanning electron microscopy. Primary HDPC s isolated from premolars were stimulated with different intensities of electric current for 30 s. Then, cell viability was tested using the 3‐(4,5‐dimethylthiazol‐2‐yl)‐2,5‐diphenyl tetrazolium bromide ( MTT ) assay. Specimens bonded with application of electrical current intensities of 50, 60, 70, and 90 µ A exhibited a significant increase in immediate µ TBS compared with all other groups. Bonded interfaces prepared using electrically assisted current application showed reduced interfacial nanoleakage upon scanning electron microscopy. Electric current application, from 20 to 70 µ A, had no effect on the viability of HDPC s. This study provides further evidence for its future clinical use.