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Identifying Diagonal Cutter Marks on Thin Wires Using 3 D Imaging
Author(s) -
Heikkinen Ville Vili,
Kassamakov Ivan,
Barbeau Claude,
Lehto Sami,
Reinikainen Tapani,
Hæggström Edward
Publication year - 2014
Publication title -
journal of forensic sciences
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.715
H-Index - 96
eISSN - 1556-4029
pISSN - 0022-1198
DOI - 10.1111/1556-4029.12291
Subject(s) - sample (material) , diagonal , microscope , microscopy , materials science , interferometry , optics , microscope slide , confocal , white light interferometry , confocal microscopy , optical microscope , artificial intelligence , computer science , computer vision , biomedical engineering , pattern recognition (psychology) , scanning electron microscope , chemistry , chromatography , mathematics , physics , engineering , geometry
Abstract We present work on matching 2‐mm‐thick wires using optical 3 D imaging methods. Marks on such small surfaces are difficult to match using a comparison microscope as this 2 D imaging method does not provide height data about the sample surface. Moreover, these 2 D microscopy images may be affected by illumination. Hence, the reference and investigated sample should be present at the same time. We employed scanning white light interferometry and confocal microscopy to provide quantitative 3 D profiles for reliable comparison of samples that are unavailable for simultaneous analysis. We show that 3 D profiling offers a solution by allowing illumination‐independent sample comparison. We correctly identified 74 of 80 profiles using consecutive matching striae ( CMS ) criteria, and we were able to match samples based on profiles measured using different 3 D imaging devices. The results suggest that the used methods allow matching cutter marks on thin wires, which has been difficult previously.