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Optimization of Wafer Exposure Patterns Using a Two‐Dimensional Cutting Algorithm
Author(s) -
Chien ChenFu,
Deng JingFeng
Publication year - 2001
Publication title -
international transactions in operational research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.032
H-Index - 52
eISSN - 1475-3995
pISSN - 0969-6016
DOI - 10.1111/1475-3995.00331
Subject(s) - wafer , wafer fabrication , factory (object oriented programming) , semiconductor device fabrication , reduction (mathematics) , computer science , yield (engineering) , algorithm , mathematical optimization , manufacturing engineering , materials science , mathematics , engineering , nanotechnology , composite material , geometry , programming language
The semiconductor industry plays an integral role in Taiwan's manufacturing sector. Although defect reduction has received considerable attention to improve the yield rate, the problem of optimizing wafer exposure patterns has seldom been addressed. This study formulates the wafer exposure‐patterning problem into a cutting and packing problem by adopting an innovative approach. We developed a two‐dimensional cutting algorithm to maximize the number of dies that can be produced from a wafer to increase the gross die yield. The proposed algorithm is successfully implemented in a wafer fabrication factory. Experimental results validate the effectiveness of the proposed algorithm.