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Introduction to the Special Issue on PACLING '97
Author(s) -
Kogure Kiyoshi,
Nakamura Junichi
Publication year - 1999
Publication title -
computational intelligence
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.353
H-Index - 52
eISSN - 1467-8640
pISSN - 0824-7935
DOI - 10.1111/0824-7935.00084
Subject(s) - computer science , citation , library science
The use of language is a fundamental capability of human intelligence and has been studied in various research fields. Among these fields, natural language processing focuses on computational mechanisms for understanding and processing natural languages, with an emphasis on practical applications. Some research results, such as word processing and machine translation systems, are now being actively applied. However, more research is needed. PACLING is a conference on natural language processing that grew out of the successful Australia–Japan and Japan–Australia Joint Symposia on Natural Language Processing, which were held in Melbourne, Australia, in November 1989, and in Iizuka, Japan, in October 1991 (Huang 1989; Nakamura and Kogure 1991). PACLING seeks to promote friendly scientific relations among Pacific region countries, with an emphasis on interdisciplinary scientific exchanges in computational linguistics and technological transfers within the Pacific region. After the first and second meetings of PACLING, held in Vancouver, Canada, in April 1993, and in Brisbane, Australia, in April 1995 (McFetridge and Popowich 1993; Matthiessen 1995), the third meeting, PACLING ’97, was successfully held in Ohme, Japan, in September 1997 (Kogure and Nakamura 1997). The host was the organizing committee of PACLING, and the cooperative hosts were the Association for Natural Language Processing, the technical group on Natural Language Understanding and Models of Communication of the Institute of Electronics, Information and Communication Engineers, and the technical group on Thought and Language of the Institute of Electronics, Information and Communication Engineers. This special issue has grown out of the Ohme conference, and contains five selected articles from papers initially presented at the conference.