z-logo
Premium
Improving the thermal conductivity and mechanical properties of Si 3 N 4 ceramic by regulating bimodal microstructure
Author(s) -
Liu Yun,
Liu Ruixiang,
Tong Zongwei,
Zheng Yuanhang,
Zhao Jixue,
Sui Tianyi,
Li Xiaolei,
Lin Bin
Publication year - 2025
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.20519
Abstract The preparation of silicon nitride (Si 3 N 4 ) ceramics with high thermal conductivity and excellent mechanical properties has been a challenge, which limits their application in high‐power devices. In this work, a two‐step sintering process was designed to regulate the content of in situ‐generated β‐Si 3 N 4 seeds, which enables fine control of the bimodal microstructure and the successful fabrication of Si 3 N 4 ceramics with excellent properties. Remarkably, the mechanism of bimodal microstructure evolution of two‐step sintered Si 3 N 4 ceramics is elucidated, and the effect of the difference in the degree of bimodal microstructure on thermal conductivity and mechanical properties is also explained. After pre‐sintering at 1390°C for 2 h and second‐step sintering at 1900°C for 12 h, the thermal conductivity, bending strength, and fracture toughness of Si 3 N 4 ceramics were 104.6 ± 0.36 W·m −1 ·K −1 , 725 ± 14.5 MPa, and 9.9 ± 0.65 MPa·m 1/2 , respectively. Overall, this study provides a strategy to enhance the thermal and mechanical properties of Si 3 N 4 ceramics by optimizing the bimodal microstructure.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom