
Fabrication of Linear Array and Top-Orthogonal-to-Bottom Electrode CMUT Arrays With a Sacrificial Release Process
Author(s) -
Benjamin A. Greenlay,
Roger J. Zemp
Publication year - 2017
Publication title -
ieee transactions on ultrasonics, ferroelectrics, and frequency control
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.159
H-Index - 136
eISSN - 1525-8955
pISSN - 0885-3010
DOI - 10.1109/tuffc.2016.2620425
Subject(s) - fields, waves and electromagnetics
The microfabrication processes for sacrificial-release-based capacitive micromachined ultrasound transducer arrays are provided with an emphasis on top-orthogonal-to-bottom electrode 2-D arrays. These arrays have significant promise for high-quality 3-D imaging with reduced wiring complexity compared with fully wired arrays. The protocols and best practices are outlined in significant detail along with design considerations and notes of caution for pitfalls and factors impacting yield.